<Background>
For encapsulation of silicon diodes, lead glasses have been used to prevent silicon chips from damage by heat during sealing process. Lead glasses have good performance for sealing, because its viscosity drops easily at lower temperature. In addition, lead glasses have good acid resistance and good electrical performance as well.
Until today, there has been no alternative glass which does not contain lead components. Therefore, lead components in the glass for this application are still exempted from the requirements under RoHS regulations, which will be effective on and after July 2006.
However, before RoHS regulations are effective, many electronic manufactures are working on eliminating lead and lead components from their products, regardless requirements or exemptions.
With rapid increase of lead-free requirement, Nippon Electric Glass has developed lead-free glass sleeves for semiconductor encapsulation and finally achieved satisfactory performances of glass, such as low sealing temperature and acid resistance, which are required for silicon diode encapsulation.
<Outline>
1. Size@@O.D. 1.78 I.D. 0.86 L. 3.81@etcc @
2. Features
(1) Lead Free
There are no lead components in the glass composition.
(2) Low sealing temperature
NL-16 can be sealed at almost the same temperature as lead glass.
(3) Good acid resistance
NL-16 can be used for the products such as LLD diodes that require plating on the terminals by using acid.