Report

JPCA Show 2015

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Brochure

Nippon Electric Glass Product Guide for Electronics Packaging(PDF:1.3MB)

Our Booth

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Our exhibits

  • High-function Powder Glass for Semiconductor Packaging
  • <Glass-ribbon> and Laser-sealing Technology
  • Zero CTE Glass <ZERØ> and Negative/Low-expansion Glass
  • Glass for Supporting Semiconductor wafers, Micro Tube
  • Ultra Thin Glass <G-Leaf>
  • Antibacterial Glass Powder, etc.

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