Brochure
Nippon Electric Glass Product Guide for Electronics Packaging(PDF:1.3MB)
Our Booth
Our exhibits
- High-function Powder Glass for Semiconductor Packaging
- <Glass-ribbon™> and Laser-sealing Technology
- Zero CTE Glass <ZERØ™> and Negative/Low-expansion Glass
- Glass for Supporting Semiconductor wafers, Micro Tube
- Ultra Thin Glass <G-Leaf™>
- Antibacterial Glass Powder, etc.