Glass Wafer for CSP
Low expansion, alkali-free, and polishing-free glass wafer
Low expansion, alkali-free, and polishing-free glass wafers are used for the cover glass of Wafer Level Chip Size Package (WLCSP) CMOS image sensors.
Features
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Alkali-free and polishing-free
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Environmentally friendly, As- and Sb-free
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Excellent surface quality
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Various thin film coatings available
Properties
| Properties/Glass code | ABC-1 | ||
|---|---|---|---|
| Coefficients of thermal expansion | 30～380℃ | ×10-7/K | 37 |
| Density | ×103kg/m3 | 2.52 | |
| Young's modulus | GPa | 78 | |
| Poisson's ratio | 0.2 | ||
| Volume resistivity Log ρ | 350℃ | Ω･cm | 13.0 |
| Dielectric constant | 1MHz, RT | 5.6 | |
| tan δ | 1MHz, RT | 0.001 | |
| Refractive index (nd) | 587.6nm | % | 1.53 |
| Transmittance | λ=550nm | % | 92 |
Application Examples
Configuration Image of Smartphone Camera
Event Information
We will be exhibiting at the following events.
