Inorganic Core Substrate for Semiconductor Packaging
Inorganic core substrate engineered for high-performance semiconductor packaging
Advancing micro through-hole (via) processing with CO₂ laser technology
The inorganic core substrate is designed for high-performance, high-density semiconductor packages. We are accelerating the development of glass core substrates—and our proprietary glass-ceramic substrates, GC Core™—by leveraging micro through-hole (via) processing with a general-purpose CO₂ laser.
What Is an Inorganic Core Substrate?
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An inorganic core substrate is an alternative to conventional organic substrates that connect semiconductor chips to external circuits. Instead of using organic materials like those found in glass epoxy substrates, inorganic core substrates employ inorganic materials to deliver superior electrical properties, enhanced rigidity, and exceptional flatness. NEG is advancing this technology by developing both glass-ceramic core substrates GC Core™ and glass core substrates.
| Organic core substrate | Inorganic core substrate | |
|---|---|---|
| Electrical properties | Inferior | Superior |
| Rigidity | Low | High |
| Flatness | Inferior | Superior |
Inorganic Core Substrate Strengths
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Micro through-hole (via) processing using general-purpose CO2 laser
For inorganic core substrates, we employ a laser modification and etching method for drilling micro vias that minimizes the risk of cracking. Although this process can involve multiple steps and extend processing times, using widely available CO₂ laser drilling equipment helps streamline the procedure and ensures a stable supply during mass production. -
Core substrate selection focused on thermal design
Thermal management is critical in semiconductor packaging to ensure reliability. In addition to our glass-ceramic core substrates, we are expanding our glass core substrate offerings, enabling us to provide core substrates with coefficients of thermal expansion precisely tailored to meet specific thermal design requirements. -
Extensive experience from material selection to processing
With years of experience supplying components for the semiconductor industry, we excel from material selection through final processing. This expertise allows us to propose core substrates with optimized dielectric properties that meet the unique demands of your applications.
Applications of inorganic core substrate
Micro through-hole (via) and cross-sectional image of glass-ceramic core substrate GC Core™
Micro through-hole (via) and cross-sectional image of glass core substrate SEM image
Glass-Ceramic Core Substrate GC Core™
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By adjusting the composition and mixing ratio of glass and ceramics, this core substrate achieves a balance of key properties, including dielectric properties, coefficients of thermal expansion, and strengths.
A large substrate size (515×510mm) has been developed for next-generation semiconductor packages.
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Features
・Low dielectric constant, high expansion, and exceptional strength -
・Customizable to meet specific application requirements
| Type | Low dielectric constant type | High expansion type | High strength type | |
|---|---|---|---|---|
| Product code | GCC-1 | GCC-2 | GCC-3 | |
| Dielectric loss tangent | 2.45 GHz | 0.0013 | 0.0002 | 0.0004 |
| 40 GHz | 0.0016 | 0.0004 | 0.0007 | |
|
Dielectric constant |
2.45 GHz | 3.9 | 7.0 | 7.9 |
| 40 GHz | 3.8 | 6.8 | 7.6 | |
| Coefficient of thermal expansion (ppm/°C) | 6.1 | 8.9 | 7.4 | |
| Bending strength (MPa) | 150 | 260 | 340 | |
Glass Core Substrate
Compared to organic material-based substrates like glass epoxy substrates, this core substrate offers superior flatness, smoothness, and rigidity, making it well-suited for larger sizes. We continue to refine its development to maximize its potential benefits.
Expected Benefits
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Improved Productivity
・Streamlined processing and reduced equipment investment with CO₂ laser technology
・Increased availability of large core substrates -
Excellent Reliability
・Reduced dimensional changes and warping under high temperature and humidity conditions
・Suitable for fine wiring and high-density mounting
When contacting us, please select “Glass Wafer for Supporting Semiconductors” from the dropdown menu.
Event Information
We will be exhibiting at the following events.
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