Development of GC Core™ with a Large Panel Size of  515 × 510 mm

Nippon Electric Glass Co., Ltd. (Head Office: Otsu, Shiga, Japan; President: Akira Kishimoto) has developed the glass-ceramic core substrate GC Core™, with a large panel size of 515 × 510 mm for next-generation semiconductor packages that require larger substrates.

In recent years, with the growing demand for data centers and the spread of generative AI, there has been a demand for even higher performance in the semiconductors used in these applications. To meet this demand, chiplets are needed to fit multiple chips into a single package, which requires a larger substrate. Additionally, as semiconductor performance improves, the chips mounted on substrates continue to grow larger. To more efficiently arrange these large chips, larger substrates are required.
In response to these challenges, in June of last year, the company developed a GC Core™ (300 mm square) substrate, which uses a composite of glass powder and ceramic powder, and has been proposing it to semiconductor manufacturers. The GC Core™ is economical because it can be drilled quickly and crack-free using commonly used CO2 laser processing machines and is expected to reduce mass-production costs.

The company has recently succeeded in developing a GC Core™ substrate with a large panel size of 515 × 510 mm, which is largely used in semiconductor manufacturing processes. This will enable semiconductor manufacturers to use the equipment they currently use and reduce capital investment, marking a major step forward toward mass production of next-generation semiconductor packages.
The large-panel-size GC Core™ will be exhibited at the 39th NEPCON JAPAN, which will be held at Tokyo Big Sight from January 22.

Exhibition name: 39th NEPCON JAPAN
Period: Wednesday, January 22 to Friday, January 24, 2025
Venue: Tokyo Big Sight
Booth: E28-14
Exhibition invitation ticket available free of charge at:
https://www.nepconjapan.jp/tokyo/ja-jp.html#/

Inorganic core substrate product page

Started Development of Glass Core Substrates Compatible with CO₂ Laser Processing (Dec 4, 2024)
https://www.neg.co.jp/en/news/20241204.html　

Joint Development Agreement Signed with Via Mechanics (Nov 19, 2024)
https://www.neg.co.jp/en/news/20240605-7549_1.html

Development of GC Core™— Glass-Ceramics Core (Jun 5, 2024)
https://www.neg.co.jp/en/news/20240605-7549.html